| 摘要 |
PROBLEM TO BE SOLVED: To perform the alignment of the discharge position of a nozzle correctly and quickly. SOLUTION: An alignment jig 30 is formed into the same shape as that of a spin chuck for retaining a wafer W in a resist coating device. The top surface 31a of the alignment jig 30 is provided with photo-electric sensors S1 to S5 and K1 to K5 each having a pair of light-emitting section and light-receiving section. Rays R1 to R5 of the photo-electric sensors S1 to S5 and rays R6 to R10 of the sensors K1 to K5 are arranged in a lattice pattern. The ray R3 and the ray R8 intersect orthogonally at a reference position on a rotation axis J at the center of the top surface 31a. The alignment jig 30 is attached to the resist coating device in place of the spin chuck, the nozzle is lowered into the ray lattice range of the alignment jig 30, either ray is shaded, and the nozzle is moved from the light-shielded position to the reference position. Coodinates for setting the discharge position of the nozzle are changed to those with respect to the nozzle moved to the reference position. COPYRIGHT: (C)2004,JPO
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