| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic part, having solder bump terminals supplementing irregularities of the heights of a plurality of terminals in the surface mounted electronic component, without melting the solder balls or printing solder paste. <P>SOLUTION: Through-holes 3 and 8 are made in soldered parts 2 and 7 of the terminal. Solder is made to freely penetrate the through holes 3 and 8, and to reciprocate by a previously decided size in the through direction. Removal preventing parts 5 and 6, having diameters larger than those of the through holes 3 and 8, are disposed at both ends of through solder (solder bump 4). Thus, a solder bump 4 is prevented from falling out, and the solder bump is brought surely into contact with the soldered parts, even if the heights of the soldered parts 2 and 7 and the heights of the soldered parts are irregular, and sure soldering is realized. <P>COPYRIGHT: (C)2004,JPO</p> |
