| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide metal laminate in which short-circuit faults are reduced after a wiring circuit is made and on which fine wiring can be formed. SOLUTION: The polyimide metal laminate includes a thermoplastic polyimide resin laminated on copper and copper alloy foils and at least one or two non-thermoplastic polyimide resin layer(s) formed on the thermoplastic polyimide resin. In this laminate, an Si element deposition amount on a surface (S surface) of the copper and copper alloy foils on which the thermoplastic polyimide is not laminated is 7(atomic %) or less by an XPS (X-ray photoelectron spectroscopy) by a measurement area of 10μm×10μm or less. COPYRIGHT: (C)2004,JPO |
