| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which prevents a liquid sticking material from dripping on the side of a reinforcing plate by decreasing the amount of a liquid pool that a sticking material which is left without being scattered by a centrifugal force forms when the surface of the reinforcing plate is coated with the liquid sticking force by rotation, and the reinforcing plate. SOLUTION: While resist 2 is dripped on the surface 101a of the reinforcing plate which is sucked by a chuck 5, the chuck 5 is rotated at a high speed. The centrifugal force generated by the high-speed rotation is used to spread the resist 2 dripped in the center of the reinforcing plate 101 over the entire surface. Excessive resist 2 is scattered as resist mist 8 by the centrifugal force and discharged through an exhaustion system 10. The edge of the outer circumferential part of the reinforcing plate 101 is beveled 102 and a film of pure water 103 is formed, so draining of the resist 2 by the centrifugal force is excellent and the amount of the resist pool 2a formed at the outer circumferential part of the reinforcing plate 101 is small. COPYRIGHT: (C)2004,JPO
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