发明名称 Deposition method of dielectric layer
摘要 <p>Provided is a method for depositing a dielectric layer (13) on a substrate (11). Oxidation barrier layers (10) for preventing the oxidation and diffusion of a lower electrode are inserted into the interfaces between the substrate (11) and a dielectric layer (13) and between the dielectric layers (13, 15, 17). Accordingly, a capacitor having a low leakage current and a high capacitance is obtained. In addition, a dielectric constant is controlled by adjusting a lattice constant so that a multi-layer structure of high dielectric constant is formed on a large substrate. &lt;IMAGE&gt;</p>
申请公布号 EP1383162(A2) 申请公布日期 2004.01.21
申请号 EP20020257887 申请日期 2002.11.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JUNG-HYUN;CHO, YOUNG-JIN;MIN, YO-SEP
分类号 H01L21/205;H01L21/02;H01L21/28;H01L21/316;H01L21/8242;H01L27/108;H01L29/51;(IPC1-7):H01L21/316 主分类号 H01L21/205
代理机构 代理人
主权项
地址