Cold plate utilizing fin with evaporating refrigerant

摘要

All improved cold plate cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate. A fin material is inserted in the cold plate and refrigerant is circulated through the fin, allowing the cold plate and fin to transfer heat from the electrical or electronic components, as the liquid refrigerant is at least partially evaporated by the heat generated by the components.