| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide sheets for card arrangement, an IC card and a method for manufacturing the IC card by which occurrence of accumulated air or distorted printing is suppressed without requiring high precision to collating of the sheets. <P>SOLUTION: In the IC card 21 having through holes 34a and 34b for housing circular metallic plates 27a and 27b for protecting an IC chip 22 formed at inner core sheet materials 28a and 28b, a plurality of continuous notched parts 34N projecting outward radially are formed in the peripheries of the through holes 34a and 34b. Thus, even when the displacement of the metallic plates 27a and 27b with respect to the through holes 34a and 34b occurs, a gap G is filled securely with resin to surppress the occurrence of accumulated air or distorted printing. <P>COPYRIGHT: (C)2004,JPO |
