| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To planarize a surface by forming an insulation resin layer of a uniform thickness. <P>SOLUTION: A multitude of thickness control spacers 7 are formed on the main surface of an organic wiring substrate 2, on which conductor patterns 3 are formed, so as to be positioned at least on the conductor patterns 3 and, thereafter, insulation resin is applied on the main surface. Pressure is applied under the non-cured condition of the insulation resin until the surfaces of a pressing member 9 reaches the thickness control spacers 7 and a curing treatment is applied while retaining the pressed condition of the insulation resin at the position whereby the insulation resin layer 5, having a flat surface 5a and whose thickness is uniform as a whole, is formed. <P>COPYRIGHT: (C)2004,JPO</p> |
