| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with a wafer level CSP structure which makes thin an electronic component in which the semiconductor device and a wiring board are bonded, easily deals with the narrowing of a pitch of an electrode pad and improves reliability in bonding with the wiring board. SOLUTION: In the semiconductor device having a wafer level package structure in which the CSP structure is formed at a wafer level, the semiconductor device includes a semiconductor wafer, the electrode pad formed on the upper side of the semiconductor wafer, and a tail terminal formed while being electrically connected on the electrode pad in an area smaller than that of the electrode pad. COPYRIGHT: (C)2004,JPO
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