| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable package for a semiconductor device. SOLUTION: The semiconductor device comprises an insulating film, a semiconductor chip mounted on the insulating film, and a plurality of electrodes provided on one surface of the insulating film. A part of the insulating film is folded and overlapped to the side thereof where the semiconductor chip is mounted, and is further folded to protect at least a part of an end of the semiconductor chip. COPYRIGHT: (C)2004,JPO |
