发明名称 Pattern formation method
摘要 After forming a resist film from a positive chemically amplified resist material, an insolubilization treatment for making the surface of the resist film insoluble in a developer is carried out. After the insolubilization treatment, pattern exposure is performed by selectively irradiating the resist film with exposing light. Thereafter, the resist film is developed so as to form a resist pattern made of an unexposed portion of the resist film.
申请公布号 US2004009433(A1) 申请公布日期 2004.01.15
申请号 US20030610920 申请日期 2003.07.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ENDO MASAYUKI;SASAGO MASARU
分类号 G03F7/039;G03F7/16;G03F7/26;G03F7/32;G03F7/38;H01L21/027;(IPC1-7):G03F7/20 主分类号 G03F7/039
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