| 摘要 |
PROBLEM TO BE SOLVED: To provide a vessel for storing semiconductor wafer, which can prevent a support stuck to a wafer by ultraviolet curing-type adhesive from being peeled off during transport. SOLUTION: The vessel is formed of a vessel body 11 where the thin wafer 2 to which the support is stuck by ultraviolet curing-type adhesive is stored and of a lid 12, and it interrupts light whose wavelength is not more than 500nm. COPYRIGHT: (C)2004,JPO |
