| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To accurately predict a warp of a base board while reflecting a difference due to density of a wiring pattern. <P>SOLUTION: A plurality of elements n having optional shapes and dividing a multilayer wiring base board into a plurality of sections on the basis of model data representing a configuration of the multilayer base board are formed. Subsequently, data of the wiring pattern P formed on the multilayer wiring base board are compared with the respective elements n, and an occupation ratio of the wiring pattern P is calculated for each layer m and each element n according to a residual copper ratio z(m, n), and then, mechanical physical property values H, for example, densityρ(m, n) and elasticity E(m, n) of each layer m and each element n are calculated on the basis of the residual copper ratio z(m, n) for each element n. A warp of the multilayer wiring base board is analyzed on the basis of the densityρ(m, n) and the elasticity E(m, n). <P>COPYRIGHT: (C)2004,JPO</p> |
