发明名称 METHOD FOR MANUFACTURING WIRING BOARD FOR ELECTRIC TEST
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board for an electric test to be used for electrical inspection which requires contact continuity including continuity resistance test for high-density wiring boards such as printed boards, boards for integrated circuits, and liquid crystal display boards, etc. SOLUTION: A method for manufacturing a wiring board for an electric test is composed of an insulating board, wiring of a specified pattern buried in the insulating board, projecting electrodes provided on the wiring to touch the electrodes of a device to be tested, whrein the tips of the projecting electrodes made of an electrically conductive metal are covered with a conductive polymer. The manufacturing method for a wiring board for an electrical test comprises the steps of: burying in an arbitrary resin an electrolytic copper plating wiring pattern formed on a nickel layer by using two layer foils consisting of a carrier electrolytic copper foil and the nickel layer; setting a guide mark of the wiring formed so as to be viewed from the side of the carrier electrolytic copper foil; and forming the projecting electrodes by aligning the guide mark and the guide mark included in a negative image. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004015066(A) 申请公布日期 2004.01.15
申请号 JP20030290018 申请日期 2003.08.08
申请人 HITACHI CHEM CO LTD 发明人 NAKAMURA HIDEHIRO;NAKAMURA MASANORI;TSUBOMATSU YOSHIAKI;KUWANO ATSUSHI;WATANABE ITSUO;FUKUTOMI NAOKI
分类号 G01R1/073;H05K3/00;H05K3/20;H05K3/24;H05K3/40;(IPC1-7):H05K3/40 主分类号 G01R1/073
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