| 发明名称 |
Package for mounting semiconductor device |
| 摘要 |
A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal. |
| 申请公布号 |
US2004007383(A1) |
申请公布日期 |
2004.01.15 |
| 申请号 |
US20030409929 |
申请日期 |
2003.04.10 |
| 申请人 |
MOURI MORIHIKO;OKUMA SADAYUKI;TAKAHASHI YASUSHI;ONO TAKAO;SAKAGUCHI YOSIHIRO;NAKAMURA ATSUSHI;MIYAZAWA TOSHIO |
发明人 |
MOURI MORIHIKO;OKUMA SADAYUKI;TAKAHASHI YASUSHI;ONO TAKAO;SAKAGUCHI YOSIHIRO;NAKAMURA ATSUSHI;MIYAZAWA TOSHIO |
| 分类号 |
H01L23/29;H01L23/31;H01L23/34;H01L23/373;(IPC1-7):H01L23/34;H05K1/03 |
主分类号 |
H01L23/29 |
| 代理机构 |
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| 主权项 |
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