| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which allows the production of low-cost and reliable semiconductor devices, by including a process of bringing an inspection device into a reliable contact with electrode pads while controlling damages on the electrode pads by appropriate pressure, even if many electrodes are inspected, and thereby increasing a manufacturing yield in semiconductor manufacturing processes and reducing a manufacturing cost. SOLUTION: In the semiconductor manufacturing processes, a substrate to be used for failure inspection of a semiconductor device comprises a beam, a projecting probe which is equipped in the beam and is to be brought into contact with the electrodes to be inspected (electrode pads) of a semiconductor device to be inspected, and a secondary electrode which is electrically connected to one side of the substrate opposite from the side where the probe is formed, via the probe and a conductive member. The semiconductor device manufacturing processes include an inspection process which is carried out by bringing the inspection device with the probe formed with a layer having many projections, into contact with the electrodes of the semiconductor device to be inspected. The failure test of the semiconductor device can be carried out by the inspection process. COPYRIGHT: (C)2004,JPO
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