WIRING PATTERN STRUCTURE AND METHOD FOR FORMING BUMP

摘要

A wiring pattern structure comprising first and second pattern lines extending in parallel, and bump receiving pads being connected with the first pattern line, wherein the bump receiving pad comprises a first part connected with the first pattern line and extending to the second pattern line side while being bent, and a second part connected with the first part and extending perpendicularly to the second pattern line while being bent to the second pattern line side at a position on the extension of the second pattern line.