| 摘要 |
PROBLEM TO BE SOLVED: To blow out a foreign material and moisture in a suction hole so that they are not accumulated when blowing out low pressure air from the suction hole to prevent chips sticking after inspection. SOLUTION: The prevent the chip 11 from sticking with ultrasonic vibration of a stage 13. Consequently, the ultrasonic vibration has no time lag or dispersion. The stage 13 is maintained clean without foreign materials and the moisture in a suction hole 14. COPYRIGHT: (C)2004,JPO |
