发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of measuring plasma luminescence in a processing chamber stably and accurately for a long period without degrading the transmissivity of a measurement port for measuring the plasma luminescence. SOLUTION: For measuring the emission state of a plasma generated in the apparatus, stable plasma measurement can be realized by installing at least one or more branching pipes on a structure contacting to the plasma and a measurement window 140 at the end of the branching pipe and then preventing pollution on the measurement window 140 when measuring the plasma. The plasma processing apparatus has a mechanism heating a component part in the processing chamber in a vacuum state to an arbitrary temperature with an optical heating source 160 arranged in an atmospheric side. Therein the measurement window 140 capable of improving the accuracy of the results of temperature measurement is provided by preventing stray light from the optical heating source 160 or the entry of light caused by the plasma luminescence in the processing chamber and then eliminating the affect of radiation heat from other than these component parts in the processing chamber. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004014968(A) 申请公布日期 2004.01.15
申请号 JP20020169567 申请日期 2002.06.11
申请人 HITACHI HIGH TECH CORP 发明人 SUEHIRO MITSURU;KANEKIYO HIROSHI;FUJIMOTO TETSUO;FURUSE MUNEO;WATANABE KATSUYA
分类号 H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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