Method for fabricating stacked chip package device

摘要

The stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding-pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame by utilizing a conductive adhesive material. A connecting hole is formed in the outer end of the inner lead for better electrical connection when soldered. The entire resultant structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.