| 摘要 |
PURPOSE: A semiconductor manufacturing apparatus having a multi-chamber is provided to be capable of minimizing mechanically generated particles by using a substrate transfer chamber installed with a substrate transfer robot. CONSTITUTION: A semiconductor manufacturing apparatus includes a substrate transfer chamber. At this time, the substrate transfer chamber is provided with a chamber dividing plate(301) for dividing the substrate transfer chamber into an upper and lower portion, a substrate transfer robot, and magnetic contact parts(315,316) located between the chamber dividing plate and the substrate transfer robot for reducing the friction between the chamber dividing plate and the substrate transfer robot. At the time, the substrate transfer robot includes a rotary shaft, a substrate holding part installed at the upper portion of the rotary shaft for loading a semiconductor substrate, and a driving part installed at the lower portion of the rotary shaft for driving the substrate holding part.
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