发明名称 MODULE TEST SOCKET
摘要 PURPOSE: A module test socket is provided to prevent connection pins of a module from being damaged and improve test efficiency. CONSTITUTION: A module test socket is interposed between a tester that measures electrical characteristics of a module(100) including a connector(110) having a plurality of connection pins(113) and the connector. The module test socket includes a socket body, a plurality of through-holes(13), buffer connection pins(30), and a fixing member(20). The socket body has a plate-shape combining part(11). One side of the combining part is connected to the tester and the other side is connected to the connector. The plurality of through-holes are formed in the combining part and correspond to the plurality of connection pins. The buffer connection pins are inserted into the through-holes. One end of each buffer connection pin comes into contact with the connection pin and the other end is connected to the tester. The buffer connection pins are elastically expended or reduced in the length direction. The fixing member fixes the module when the module is tested.
申请公布号 KR20040003910(A) 申请公布日期 2004.01.13
申请号 KR20020038740 申请日期 2002.07.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN, SEUNG MAN
分类号 H01R33/76;(IPC1-7):H01R33/76 主分类号 H01R33/76
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