发明名称 |
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication |
摘要 |
An apparatus and method for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die and conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.
|
申请公布号 |
US2004004294(A1) |
申请公布日期 |
2004.01.08 |
申请号 |
US20020191655 |
申请日期 |
2002.07.08 |
申请人 |
HALL FRANK L.;BAERLOCHER CARY J. |
发明人 |
HALL FRANK L.;BAERLOCHER CARY J. |
分类号 |
H01L21/56;H01L23/31;H01L23/495;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|