发明名称 |
SEALING MEMBER, AND METHOD FOR PRODUCING SURFACE ACOUSTIC WAVE APPARATUS BY USING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for mass-producing a surface acoustic wave apparatus in simplified processes. <P>SOLUTION: A surface acoustic wave element 10 is flip-chip-mounted on a wiring board 20 in a manner that a function face of the surface acoustic wave element 10 with bumps 4 formed thereto faces the wiring board 20 with each other. Then hot press forming is applied to the wiring board 20 and the sealing member 18 comprising a base 8 provided with an uncured resin sheet 7 to resin-seal the surface acoustic wave element 10. The base of the sealing member 18 has a higher flexural rigidity than that of the uncured resin sheet in the case of the hot press forming and is integrated with the uncured resin sheet. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004007051(A) |
申请公布日期 |
2004.01.08 |
申请号 |
JP20020157571 |
申请日期 |
2002.05.30 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
KIKUCHI TAKUMI;FUJIOKA HIROFUMI |
分类号 |
H03H9/25;H03H3/08;(IPC1-7):H03H9/25 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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