发明名称 |
PACKAGE FOR OPTICAL SEMICONDUCTOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To make a structure inexpensive and highly reliable in a form capable of inhibiting incidence of light from a light emitting element to a light receiving element when housing the light emitting element and the light receiving element in a single package. <P>SOLUTION: In the optical semiconductor package having a laminated structure, a groove is provided at a position between the light emitting element and the light receiving element. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004006753(A) |
申请公布日期 |
2004.01.08 |
申请号 |
JP20030085357 |
申请日期 |
2003.03.26 |
申请人 |
CANON INC |
发明人 |
IGAKI MASAHIKO;OGURA MAKOTO;KOSAKA TADASHI;ATSUTA AKIO |
分类号 |
H01L31/02;H01L31/12;H01L31/173;H01L33/54;H01L33/56 |
主分类号 |
H01L31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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