发明名称 PACKAGE FOR OPTICAL SEMICONDUCTOR
摘要 <P>PROBLEM TO BE SOLVED: To make a structure inexpensive and highly reliable in a form capable of inhibiting incidence of light from a light emitting element to a light receiving element when housing the light emitting element and the light receiving element in a single package. <P>SOLUTION: In the optical semiconductor package having a laminated structure, a groove is provided at a position between the light emitting element and the light receiving element. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004006753(A) 申请公布日期 2004.01.08
申请号 JP20030085357 申请日期 2003.03.26
申请人 CANON INC 发明人 IGAKI MASAHIKO;OGURA MAKOTO;KOSAKA TADASHI;ATSUTA AKIO
分类号 H01L31/02;H01L31/12;H01L31/173;H01L33/54;H01L33/56 主分类号 H01L31/02
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