SUBMINIATURE ELECTRONIC CONTACT AND INTEGRATED BODY

摘要

PROBLEM TO BE SOLVED: To provide an assembly of contacts useful for mounting semiconductor chips comprising sheet-like material having a plurality of holes aligned in a regular grid pattern, and elastic-layered contacts having a plurality of projections extending internally on the hole of the material.

SOLUTION: A connector of a subminiature electronic element is equipped with a sheet-shaped main body (30) including a plurality of holes (36) that are preferably arranged with regular grid patterns. Each hole is provided with an elastic sheathed contact (38) including a plurality of protrusions (42) extending inward above the holes of the main body. The subminiature electronic element (68) including bump reeds (70) like solder balls can be engaged with the connector by making the bump reeds (70) enter into the holes of the connector so that the bump leads become engaged with the contacts. When it has become clear that the integrated body can be tested and can be admissible, the bump leads can be connected permanently to the contacts.

COPYRIGHT: (C)2004,JPO