| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package system that enables elements to be interconnected without imposing the restriction and limitation existing in the package system on the elements. <P>SOLUTION: A flexible interconnection package system includes a flexible substrate material containing an internal trace connected to a fingerprint sensor mounted on a substrate. The bonding pad of the fingerprint sensor is connected to the conductive trace pad of the internal trace by using such a technique as the wire bonding, ball/bump method, tape automated bonding (TAB), or another arbitrate bonding method appropriate to integrated circuits. The final package includes a premolded package forming an opened space. Consequently, it becomes possible to expose the surface of the fingerprint sensor to the user for access. <P>COPYRIGHT: (C)2004,JPO |
