PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg to which an epoxy resin composition having both high heat conductivity and good solubility in organic solvents is applied, to provide a laminated board, and to provide a printed circuit board. SOLUTION: This prepreg prepared by impregnating a sheet-like fiber substrate with an epoxy resin composition comprising an epoxy resin and a curing agent and then curing the product into a semi-cured state is characterized in that the epoxy resin is the reaction product of an epoxy compound (A) having a molecular structure represented by formula (1) with a phenyl compound (B) having a structure represented by formula (2), and that the equivalent ratio of the active hydrogen atoms of the compound (B) to the epoxy groups of the compound (A) is 0.25 to 0.7. COPYRIGHT: (C)2004,JPO