| 摘要 |
PROBLEM TO BE SOLVED: To provide a vertical base structure, which is prevented from slipping and which withstands high temperatures while being manufactured by a diamond saw and will not cast a big shadow on a wafer. SOLUTION: The vertical base for supporting a plurality of semiconductor wafers under separated and substantially parallel relations horizontally is equipped with (a) a vertical supporting means and (b) a plurality of vertically separated horizontal supporting means for dividing and forming a plurality of supporting stages for supporting wafers substantially horizontally and which are extended from the vertical supporting means. In this case, the horizontal supporting means are projections and respective projections are constituted of arms, ending at a wafer receiving table, while the arms are slanted and projected continuously upward so as to be ended at the wafer receiving table so that the most inner contact between at least one set of the wafer receiving table in respective supporting stages and a wafer supported by the receiving table becomes within a range between 20% and 80% of the radius of the wafer when it is measured from the rim of the wafer. COPYRIGHT: (C)2004,JPO |
