| 摘要 |
PROBLEM TO BE SOLVED: To eliminate aberration of images on a wafer and to obtain desired working spacing in a reduction projection system used for lithography. SOLUTION: A scanning ring-field reduction projection system is carries out lithography patterning in design units of a maximum of 0.4μm by using X-ray within a wavelength range between 300Åand 40Å. An optical configuration of this system is full-reflection type. The system includes a three-mirror structure which consists of a first concave mirror 25, a second convex mirror 26, and a third concave mirror 30. Between the second mirror 26 and the third mirror 30, a fourth concave mirror 29 for bending is furnished. COPYRIGHT: (C)2004,JPO |
