ELECTROLESS COPPER PLATING BATH AND ELECTRONIC PARTS FOR HIGH FREQUENCY

摘要

PROBLEM TO BE SOLVED: To provide an electroless copper plating bath with which the satisfactory adhesion of a copper plating film can be secured even if ceramic has a smooth surface with little roughness, and electronic parts for high frequency having satisfactory high frequency electrical conductivity, and thus having a high Qo value, and to provide electronic parts for high frequency produced by using the electroless copper plating bath. SOLUTION: The electroless copper plating bath contains copper ions, rare earth ions, formaldehyde or the derivative thereof, and tartaric acid or the salt thereof. The rare earth ions are cerium ions. Then, the concentration of the cerium ions lies within the range of 2.0×10-7to 1.0×10-4mol/L, or within the range of 2.8×10-7to5.6×10-5mol/L. COPYRIGHT: (C)2004,JPO