METHOD FOR FABRICATING MULTI-LAYERED PCB USING BUMP

摘要

PURPOSE: A method for fabricating a multi-layered PCB using a bump is provided to mount a plurality of electronic components by forming a bump instead of a via hole. CONSTITUTION: A via hole(20) is formed on a first CCL(Copper Clad Laminate)(10) having a first copper foil side(12) which is formed on both sides of a first resin layer(11). A first circuit is formed on the first copper foil side(12) by performing an etching process. A dry film(50) is laminated on both sides of the first CCL(10). An internal layer(100) is fabricated by forming a bump(60). A hole(80) is formed on a second CCL(70) having a second copper foil side(71) which is formed on both sides of a second resin layer(72). A panel plating process for the hole(80) is performed. An external layer(200) is fabricated by forming the second circuit on the second copper foil side(71) of one side of the second CCL(70) oriented to the internal layer(100). A prepreg having a hole is inserted into the bump(60) between the internal layer(100) and the external layer. A stacked structure is formed by heating and pressing the prepreg.