| 摘要 |
PURPOSE: A wafer heating apparatus is provided to prevent local heating of a wafer and achieve uniform heating. CONSTITUTION: A wafer heating apparatus includes a housing(10) that receives a wafer(20). At the lower part of the wafer(20), a heater(30) is mounted. Between the wafer(20) and the heater(30), a heat plate(40) is interposed to transfer heat generated by the heater(30) to the whole surface of the wafer(20). A reflect plate(50) is disposed at the lower part of the heater(30) to support the heater(30) and to obstruct transfer of the heat in the opposite direction to the heat plate(40). The heat plate(40) is formed in a disk shape and it has almost the same area as that of the wafer.
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