| 摘要 |
Disclosed are a method and apparatus for simultaneously inspecting and packaging chips, the method comprising a first step for advancing a film having a plurality of chip receiving recesses thereon from a film supplying roll to a film recovery roll by a step movement, inserting an uninspected chip into the chip receiving recess of the film, inspecting the chip passing under a three dimensional measuring probe by the three dimensional measuring probe, and replacing the inspected chip with a new chip by a robot arm when the probe determines that the inspected chip is abnormal, and a second step for attaching a tape onto the film to close an opening of the chip receiving recess having a normal chips therein after the first step is performed.
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