发明名称 |
Use of diamond as a hard mask material |
摘要 |
A method for producing an integrated circuit includes providing a diamond layer above a layer of conductive material. A cap layer is provided above the diamond layer and patterned to form a cap feature. The diamond layer is patterned according to the cap feature to form a mask, and at least a portion of the layer of conductive material is removed according to the mask.
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申请公布号 |
US6673684(B1) |
申请公布日期 |
2004.01.06 |
申请号 |
US20030335726 |
申请日期 |
2003.01.02 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
HUANG RICHARD J.;FISHER PHILIP A.;TABERY CYRUS E. |
分类号 |
H01L21/3213;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/3213 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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