发明名称 Use of diamond as a hard mask material
摘要 A method for producing an integrated circuit includes providing a diamond layer above a layer of conductive material. A cap layer is provided above the diamond layer and patterned to form a cap feature. The diamond layer is patterned according to the cap feature to form a mask, and at least a portion of the layer of conductive material is removed according to the mask.
申请公布号 US6673684(B1) 申请公布日期 2004.01.06
申请号 US20030335726 申请日期 2003.01.02
申请人 ADVANCED MICRO DEVICES, INC. 发明人 HUANG RICHARD J.;FISHER PHILIP A.;TABERY CYRUS E.
分类号 H01L21/3213;(IPC1-7):H01L21/336 主分类号 H01L21/3213
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