发明名称 Method and apparatus for cutting prepreg
摘要 A prepreg cutting method is provided that cuts prepreg (1) without applying any processing, such as heating, to that part of prepreg other than the place to be cut. When prepreg (1) formed by impregnating a base material with a resin and left to semi-harden is to be cut into a specified dimension, the surface of the prepreg (1) is irradiated with a laser beam (L) so that the resin of the irradiated portion is softened while the laser beam irradiating position is shifted on the prepreg, and the softened resin part is cut by a cutting blade (2). Because the cutting blade (2) cuts the prepreg portion where the resin has softened, resin dust will not scatter. <IMAGE>
申请公布号 EP1323505(A3) 申请公布日期 2004.01.02
申请号 EP20020013961 申请日期 2002.06.25
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 HARUHIKO, MIHARA
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/08;B26D1/24;B26D7/10;B29B11/02 主分类号 B23K26/00
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