Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as in PCB manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby

摘要

An improved method of and apparatus for producing preferably thin plastic protective film layers for thin shiny copper foils and the like, as for PCB applications, with electric-charge adhering of the same to the foil and with peel-off releasable properties to provide the same original pristine, shiny copper foil surface without contamination, marring or other physical, chemical or other residue despite handling and other processing procedures.