METHOD AND APPARATUS FOR ADHESIVE JOINT SEPARATION

摘要

Devices and methods for cutting an adhesively bonded joint (110), premised upon providing a joint (110) that includes an adhesive, a first component and a second component are part of the present invention. The cutting of the adhesive (110) may be by a cutter including a cutting portion (112) that is advanced about at least a portion of the periphery of the joint by an advancing mechanism (122). Kits for repairing and/or replacing components that include an adhesively bonded joint are also contemplated.