发明名称 SUBSTRATE HOLDER AND PLATING APPARATUS
摘要 The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of it easily and securely, and also a plating apparatus provided with the substrate holder. A substrate holder (18), includes: a fixed holding member (54) and a movable holding member (58) for holding a substrate (W) therebetween; a sealing member (68) mounted to the fixed holding member (54) or the movable holding member (58); and a suction pad (94) for attracting a back surface of the substrate (W) held between the fixed holding member (54) and the movable holding member (58).
申请公布号 WO2004001813(A2) 申请公布日期 2003.12.31
申请号 WO2003JP07855 申请日期 2003.06.20
申请人 EBARA CORPORATION;YOSHIOKA, JUNICHIRO;HORIE, KUNIAKI;GUO, YUGANG;MORIKAMI, SATOSHI 发明人 YOSHIOKA, JUNICHIRO;HORIE, KUNIAKI;GUO, YUGANG;MORIKAMI, SATOSHI
分类号 C25D7/12;C25D17/06;H01L21/00;H01L21/288;H01L21/60;H01L21/687 主分类号 C25D7/12
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