LASER DIODE PACKAGE HAVING TRENCH AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A laser diode package having a trench and a fabricating method thereof are provided to improve a light receiving sensitivity by forming the trench on a laser diode mounting position of a photodiode and lowering the height of a laser diode. CONSTITUTION: A laser diode package having a trench includes a laser diode(2) and a photodiode(3). The laser diode package having the trench further includes a trench region(4), a light receiving region(5), a metal electrode layer, and an adhesive layer(14). The trench region(4) is formed on an upper surface of the photodiode(3) in order to mount the laser diode(2). The light receiving region(5) is adjacent to the trench region(4) in order to receive the rear monitor beam from the laser diode(2). The metal electrode layer is used for covering partially the trench region(4) and the light receiving region(5). The adhesive layer(14) is laminated on the metal electrode layer of the trench region(4) in order to mount the laser diode(2).