发明名称 |
Resin diamond blade and optical waveguide manufacturing method using the blade |
摘要 |
A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t1, and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t2 greater than the thickness t1. The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 mum or less, and the relation between the thicknesses t1 and t2 is set to t1+0.01 mm<=T2<=T1+0.05 mm.
|
申请公布号 |
US6669537(B2) |
申请公布日期 |
2003.12.30 |
申请号 |
US20020102687 |
申请日期 |
2002.03.22 |
申请人 |
FUJITSU LIMITED |
发明人 |
MAEDA AKIO;SHIOTANI TAKASHI |
分类号 |
G02B6/13;B24B19/22;B24B27/06;B24D3/00;B24D3/28;B24D5/12;B28D5/02;B81C1/00;G02B6/12;H01L21/00;H01L21/301;(IPC1-7):B28B1/02;B24B7/19;B24B7/30 |
主分类号 |
G02B6/13 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|