发明名称 Methods of and apparatus for molding structures using sacrificial metal patterns
摘要 Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB(TM) formation process), and typically contain features having resolutions within the 1 to 100 mum range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.
申请公布号 US2003234179(A1) 申请公布日期 2003.12.25
申请号 US20030434315 申请日期 2003.05.07
申请人 MEMGEN CORPORATION 发明人 BANG CHRISTOPHER A.
分类号 B81B3/00;B81C1/00;C25D1/10;C25D5/02;G01P15/08;G01P15/125;(IPC1-7):C25D5/02 主分类号 B81B3/00
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