| 摘要 |
A semiconductor package (19) comprises a semiconductor chip (112) and a clip (116) and a lead frame (114) for electrically supporting the chip within the semiconductor package. The chip has at least two solder pads (120, 150) on one surface, and either or both the lead frame and clip have corresponding pedestals. Each solder pad is soldered to a respective pedestal (128, 158) on one of said lead frame and clip for supporting the chip (112) during assembly of the semiconductor package (19).
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