| 发明名称 |
Microelectronic device interconnects |
| 摘要 |
A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns. |
| 申请公布号 |
US2003234277(A1) |
申请公布日期 |
2003.12.25 |
| 申请号 |
US20020183874 |
申请日期 |
2002.06.25 |
| 申请人 |
DIAS RAJEN;CHANDRAN BIJU |
发明人 |
DIAS RAJEN;CHANDRAN BIJU |
| 分类号 |
H01L21/56;H01L23/485;H01L23/498;H05K3/32;H05K3/34;(IPC1-7):B23K31/00 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
