| 发明名称 |
METHOD FOR ADHERING SUBSTRATES USING LIGHT ACTIVATABLE ADHESIVE FILM |
| 摘要 |
<p>The present invention provides a method of connecting substrates using light activatable film while preventing the deterioration of the substrate in the process. The present invention also provides a method for connecting circuits which includes irradiating a light activatable adhesive film, contacting the first surface of the activated anisotropically conductive adhesive film with the circuit on a first substrate, contacting the circuit on a second substrate with the second surface of said activated anisotropically conductive adhesive film, and compression bonding these substrates.</p> |
| 申请公布号 |
WO02061010(A8) |
申请公布日期 |
2003.12.24 |
| 申请号 |
WO2002US02540 |
申请日期 |
2002.01.29 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY;YAMAGUCHI, HIROAKI;KITAMURA, TETSU |
发明人 |
YAMAGUCHI, HIROAKI;KITAMURA, TETSU |
| 分类号 |
B32B7/12;B32B27/08;C08G59/18;C08J5/12;C08L63/00;C09J5/00;C09J5/06;C09J7/00;C09J9/02;C09J163/00;C09J201/00;H01L21/60;H05K3/32;(IPC1-7):C09J5/06 |
主分类号 |
B32B7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
