| 摘要 |
<p>A method for evaluating the shape of a semiconductor wafer, characterized in that the front and/or back surface of a semiconductor wafer is scanned to measure shape data on the semiconductor wafer, the measured shape data is differentiated to calculate a differentiation profile, and the calculated differentiation profile is analyzed to determine surface characteristics of the semiconductor wafer. By the method, the shape quality of a semiconductor wafer, especially the shape quality of the peripheral part of a semiconductor wafer can be quantitatively evaluated from a different viewpoint of conventional SFQR, and appropriate evaluation can be made even if the specifications of the design rule are strict. A semiconductor wafer shape evaluating device is also disclosed.</p> |
