发明名称 Semiconductor device having semiconductor resistance element and fabrication method thereof
摘要 A semiconductor device having a semiconductor resistance element is capable of suppressing a variation in characteristics of the semiconductor resistance element due to an acceptor concentration which is difficult to control, thereby stably improving the yield of a semiconductor integrated circuit using the semiconductor device. The device includes an n-type semiconductor resistance region formed in the surface of a compound semiconductor substrate, and a p-type buried region formed between the n-type semiconductor resistance region and a substrate region 21S of the compound semiconductor substrate. An acceptor of the p-type buried region is set to be higher than an acceptor concentration in the substrate region and lower than a donor concentration in the n-type semiconductor resistance region, whereby the effect of the acceptor concentration in the substrate on the semiconductor resistance region can be avoided.
申请公布号 US6667538(B2) 申请公布日期 2003.12.23
申请号 US20010862042 申请日期 2001.05.21
申请人 SONY CORPORATION 发明人 IMOTO TSUTOMU
分类号 H01C13/00;H01L21/02;H01L21/822;H01L27/04;H01L27/08;H01L29/8605;(IPC1-7):H01L29/00 主分类号 H01C13/00
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