发明名称 Semiconductor device and method of fabricating the same
摘要 A gate electrode is formed on a semiconductor substrate with a gate insulating film interposed therebetween. A channel region composed of a first-conductivity-type semiconductor layer is formed in a region of a surface portion of the semiconductor substrate located below the gate electrode. Source/drain regions each composed of a second-conductivity-type impurity layer are formed in regions of the surface portion of the semiconductor substrate located on both sides of the gate electrode. Second-conductivity-type extension regions are formed between the channel region and respective upper portion of the source/drain regions in contact relation with the source/drain regions. First-conductivity-type pocket regions are formed between the channel region and respective lower portion of the source/drain regions in contact relation with the source/drain regions and in spaced relation to the gate insulating film.
申请公布号 US6667216(B2) 申请公布日期 2003.12.23
申请号 US20010996932 申请日期 2001.11.30
申请人 MATSUSHITA ELECTRONICS CORPORATION 发明人 UMIMOTO HIROYUKI;ODANAKA SHINJI
分类号 H01L21/265;H01L21/336;H01L29/10;(IPC1-7):H01L21/336 主分类号 H01L21/265
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