发明名称 |
METHOD AND APPARATUS OF SEALING WAFER BACKSIDE FOR FULL-FACE ELECTROCHEMICAL PLATING |
摘要 |
The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer. |
申请公布号 |
AU2003238863(A1) |
申请公布日期 |
2003.12.19 |
申请号 |
AU20030238863 |
申请日期 |
2003.05.30 |
申请人 |
NUTOOL, INC. |
发明人 |
JALAL ASHJAEE;HOMAYOUN TALIEH;BULENT, M. BASOL;KONSTANTIN VOLODARSKY |
分类号 |
B24B37/04;B24B37/30;C25D7/12;C25D17/00;C25D17/06;H01L21/00;H01L21/304;H01L21/306;H01L21/683;(IPC1-7):H01L21/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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