发明名称 |
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof |
摘要 |
A flip-ship semiconductor package with a lead frame as a chip carrier is provided, wherein a plurality of leads of the lead frame are each formed with at least a dam member thereon. When a chip is mounted on the lead frame by means of solder bumps, each of the solder bumps is attached to the corresponding one of the leads at a position between the dam member and an inner end of the lead. During a reflow-soldering process for wetting the solder bumps to the leads, the dam members would help control collapse height of the solder bumps, so as to enhance resistance of the solder bumps to thermal stress generated by CTE (coefficient of thermal expansion) mismatch between the chip and the leads, thereby preventing incomplete electrical connection between the chip and the leads.
|
申请公布号 |
US2003230792(A1) |
申请公布日期 |
2003.12.18 |
申请号 |
US20020196305 |
申请日期 |
2002.07.16 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
WU CHI-CHUAN;HUANG CHIEN-PING;PU HAN-PING |
分类号 |
H01L23/495;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|